生产能力
|
序号 order number |
项目 | 制程能力（一期） | 制程能力（二期） |
| Item |
Producing capability (lssue 1) |
Producing capability (lssue 2) |
|
| 1 |
最高层数 Max Layer Count |
12层 12Layer |
24层 24layer |
| 2 |
成品板厚 Final Board Thickness |
0.2-3.0mm | 0.2-3.2mm |
| 3 |
最大拼板尺寸 Max Panel size |
18.5" * 22" | 22" * 24" |
| 4 |
底铜铜厚 Cu Foil Thickness |
1/3OZ - 3OZ | 1/3OZ - 4OZ |
| 5 |
钻孔孔径 Hole size |
0.2mm-6.50mm |
导入HDI盲埋孔设计 Import the HDI blind hole design |
| 6 |
孔径公差 Hole size Tolerance |
PTH：+/-0.08mm NPTH:+/-0.05mm SLOT:+/-0.10mm |
PTH：+/-0.05mm NPTH:+/-0.05mm SLOT:+/-0.08mm |
| 7 |
纵横比 Max Aspect Ratio |
1:07:00 | 1:07:00 |
| 8 |
成型公差 Outline Tolerance |
+/-0.1mm | +0.1/-0.05mm |
| 9 |
V-CUT角度 V-CUT Angle |
20°;30° | 20°;30°;45°;60° |
| 10 |
最小线宽/线距 Min trace Width/Space |
3/3mil | 2.5/2.5mil |
| 11 |
最小BGA Min BGA size |
0.25mm | 0.2mm |
| 12 |
阻抗公差 Impedance Tolerance |
+/-10% | +/-7.5% |
| 13 |
表面处理 Surface Treatment |
喷锡;沉镍金+OSP;蓝胶 HASL;ENIG;OSP |
喷锡;沉镍金;OSP;沉镍金+OSP; 沉锡;电金;镀金;碳油;蓝胶 OSP;HASL;ENIG;OSP;ENIG+OSP; TIN;Electric gold ;Plating glod Carbon ,Peelable glue |
| 14 |
翘曲度 Warping degree and bending degree |
≤0.75% | ≤0.5% |